Advanced Packaging Inspection Process Support Engineer

About the role

As a Process Support Engineer (PSE), you’ll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high‑visibility customer support through on‑site installations, system diagnoses, and the service and repair of complex semiconductor equipment.

Key responsibilities

• Develop deep expertise in advanced packaging processes and identify inspection challenges, technology gaps, and yield improvement opportunities.
• Serve as technical lead for Kinex Mantis‑D Integrated Module Inspection systems, including macro optical inspection for HBM, 2.5D/3D packaging and hybrid bonding.
• Lead customer evaluations, demos, beta‑site activities, process qualifications and proof‑of‑concept projects.
• Define and approve deployment plans, qualification strategies and acceptance criteria for system installation and production ramp.
• Develop innovative inspection methodologies using machine vision, AI‑based defect classification and integrated solutions.

Required profile

• 6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering or advanced packaging technologies.
• Strong knowledge of semiconductor package processes such as HBM, hybrid bonding, chiplet integration and wafer‑level packaging.
• Hands‑on experience with optical inspection systems, machine‑vision applications and defect‑inspection methodologies.
• Proven ability to lead customer‑facing technical projects, evaluations and production qualifications.
• Excellent English communication and presentation skills.
• Willingness to travel internationally 20‑30% of the time.

Required skills

• Optical inspection systems
• Machine‑vision applications
• AI‑based defect classification
• Statistical data analysis
• Design of Experiments (DOE)
• Process qualification and root‑cause analysis
• Semiconductor advanced packaging processes