Metal Packaging Process Support Engineer

About the role

The Process Support Engineer will provide on‑site technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments, guiding products from concept through qualification and long‑term stabilization.

Key responsibilities

• Install, qualify, troubleshoot and stabilize Applied Materials PVD systems on‑site.
• Design and execute process experiments and DOEs, analyze results statistically, and produce technical reports.
• Diagnose and resolve complex equipment and process issues using structured root‑cause analysis.
• Collaborate with customers, field teams and internal engineering groups to meet technical objectives.
• Mentor junior engineers and support small to mid‑scale projects.

Required profile

• Master’s or Bachelor’s degree in Materials Science, Chemistry, Semiconductor Engineering or related field.
• 3–10 years experience in semiconductor process engineering, equipment support or advanced packaging.
• Strong ownership, attention to detail and ability to work in demanding fab environments.
• Excellent communication skills and proficiency in English for documentation and collaboration.

Required skills

• Physical Vapor Deposition (PVD)
• Electro Plating (EP)
• Experience with Endura/Charger platforms
• Experience with Nokota/Raider platforms
• Statistical analysis and Design of Experiments (DOE)
• Root‑cause analysis methodologies