Advanced Packaging Process Support Engineer

About the role

The Process Support Engineer will guide advanced packaging products through their full lifecycle, from concept to qualification, providing high‑visibility on‑site customer support and complex system troubleshooting.

Key responsibilities

• Perform on‑site installations, system diagnoses, and service/repair of advanced semiconductor equipment.
• Collaborate with customers and R&D to develop cutting‑edge processes for semiconductor chip manufacturing.
• Create hypothesis experiments and design of experiments (DOE), analyze data statistically, and compile detailed reports.
• Troubleshoot complex issues, conduct root‑cause analyses, and resolve challenging process engineering problems.

Required profile

• Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics or related field.
• 2–4 years of experience in a semiconductor fab or equipment environment.
• Proficiency in English communication.

Required skills

• Knowledge of Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant processes.
• Experience with hypothesis testing, design of experiments (DOE) and statistical data analysis.
• Ability to perform root‑cause analysis and technical reporting.

What we offer

• Supportive work culture encouraging learning, development and career growth.
• Health and wellbeing programs for personal and professional support.
• Opportunities to work on cutting‑edge technology in a global leader.