Substrate Supplier Enablement Engineer

About the role

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization develops substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology Integration Group, you will enable new manufacturing capacity across advanced packaging suppliers by leading substrate supplier development and qualification for technologies such as high density FCBGA, EMIB-T and glass core substrate. The role involves driving technical enablement, managing readiness milestones and working with cross-functional engineering teams and supplier partners. It requires periodic evening meetings with suppliers in East Asia and occasional travel to supplier sites.

Key responsibilities

• Develop robust building block processes with suppliers and internal engineering teams across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi-metal plating, defect inspection/metrology, electrical testing and other substrate technologies.
• Partner with on-site supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
• Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
• Design and implement factory technology validation and product certification plans focused on yield improvement.
• Develop and maintain detailed micro schedules for new factory startup activities, including key milestones.
• Lead qualification activities and monitor ramp indicators to enable an incident-free production ramp and successful introduction of new capacity.

Required profile

• Bachelor's degree with 6+ years of experience, or Master's degree with 4+ years, or PhD with 2+ years, in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics or a related technical field.
• Experience in statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
• Experience managing complex projects and delivering results in high-volume manufacturing environments.
• Preferred: a strong foundation in advanced packaging, substrates or semiconductor manufacturing; proven leadership in supplier management or technology enablement; knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies; experience with process flow development, FMEA, DOE design and problem-solving tools.

What we offer

• Hybrid work model, allowing time on-site at the assigned Intel site and off-site.
• Shift 1 (Korea, Republic of).