Advanced Packaging Inspection Process Support Engineer

About the role

As a Process Support Engineer you will guide advanced packaging inspection products through their full lifecycle, from concept to qualification, providing on‑site customer support, system diagnostics and complex equipment repairs.

Key responsibilities

• Develop deep expertise in semiconductor advanced packaging processes and identify inspection challenges, technology gaps and yield improvement opportunities.
• Serve as technical lead for Kinex Mantis‑D Integrated Module Inspection systems, including macro optical inspection for HBM, 2.5D/3D packaging and hybrid bonding.
• Lead customer evaluations, demos, beta‑site activities, process qualifications and proof‑of‑concept projects, ensuring alignment with statements of work and project milestones.
• Define and approve deployment plans, qualification strategies and acceptance criteria for system installation and production ramp‑up.
• Develop innovative inspection methodologies using machine vision, AI‑based defect classification and integrated inspection solutions.

Required profile

• 6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering or advanced packaging technologies.
• Strong knowledge of semiconductor package processes such as HBM, hybrid bonding, chiplet integration and wafer‑level packaging.
• Hands‑on experience with optical inspection systems, machine vision applications and defect inspection methodologies.
• Proven ability to lead customer‑facing technical projects, evaluations and production qualifications.
• Excellent English communication and presentation skills with willingness to travel internationally (20‑30%).

Required skills

• Optical inspection systems
• Machine vision
• AI‑based defect classification
• Statistical data analysis and design of experiments (DOE)
• Project management and technical leadership

What we offer

• Supportive work culture that encourages learning, development and career growth.
• Opportunities to work on cutting‑edge semiconductor technologies in a global leader.
• Comprehensive health, wellbeing and employee benefit programs.