Advanced Packaging Process Support Engineer

About the role

The Process Support Engineer (PSE) will guide advanced packaging products through their entire lifecycle, from concept to qualification, providing high‑visibility customer support and collaborating with R&D to develop cutting‑edge semiconductor processes.

Key responsibilities

• Provide high‑visibility customer support through on‑site installations, system diagnoses, and service/repair of complex equipment.
• Work closely with customers to develop leading‑edge processes for advanced semiconductor chips.
• Create hypothesis experiments and design of experiments (DOE), analyze data with statistics, and compile reports with high‑level conclusions.
• Troubleshoot complex problems, perform root‑cause analyses, and resolve difficult process‑engineering and product issues.

Required profile

• Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics or a related field.
• 2–4 years of experience in the semiconductor fab or equipment industry.
• Proficiency in English communication.
• Preferred: Master’s degree or PhD in a related discipline.

Required skills

• Chemical Vapor Deposition (CVD)
• Atomic Layer Deposition (ALD)
• Plasma Reactive Ion Etch (RIE)
• Physical Vapor Deposition (PVD)
• Anneal processes
• Implant processes
• Design of Experiments (DOE) and statistical data analysis

What we offer

• Supportive work culture that encourages learning, development and career growth.
• Health and wellbeing programs, including comprehensive benefits.
• Opportunities to work on cutting‑edge semiconductor and display technologies in a global leader.