Process Support Engineer – Metal Packaging (PVD/EP)

About the role

As a Process Support Engineer you will guide metal‑package products through their full lifecycle, from concept to qualification, providing on‑site technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments.

Key responsibilities

• Install, qualify, troubleshoot and stabilize PVD/EP systems on‑site for customers.
• Design and execute process experiments and design‑of‑experiments (DOE), analyze results with statistical methods and produce technical reports.
• Perform root‑cause analysis and resolve complex equipment and process issues.
• Collaborate with customers, field teams and internal engineering groups to meet technical objectives.
• Mentor junior engineers and support small‑to‑mid‑scale projects.

Required profile

• Bachelor’s or Master’s degree in Materials Science, Chemistry, Semiconductor Engineering or related field.
• 3–10 years of experience in semiconductor process engineering, equipment support or advanced packaging.
• Strong ownership, attention to detail and ability to work in demanding fab environments.
• Excellent communication and interpersonal skills for customer‑facing support.

Required skills

• Physical Vapor Deposition (PVD) and Electro Plating (EP) processes.
• Hands‑on experience with Endura/Charger and Nokota/Raider platforms.
• Design‑of‑experiments (DOE) and statistical data analysis.
• Root‑cause analysis and troubleshooting of BEOL and metal‑package processes.

What we offer

• Supportive work culture that encourages learning and career growth.
• Health and wellbeing programs for employees at work and at home.