Panel-level Advanced Packaging Process Engineer (PVD)

About the role

We are seeking an experienced Process Support Engineer (PSE) to provide high‑visibility technical support for Applied Materials PVD (Metal) equipment in panel‑level advanced packaging environments. This customer‑facing role works closely with advanced manufacturing teams to enable next‑generation panel‑based semiconductor and heterogeneous integration technologies.

Key responsibilities

• Provide on‑site technical support for PVD metal deposition systems on panel‑level platforms, including installation, qualification, troubleshooting, and long‑term process stabilization.
• Support, maintain, and optimize PVD metallization processes such as seed, barrier, and RDL metal stack deposition for panel‑level packaging.
• Design and execute process development activities and design‑of‑experiments, analyze data statistically, and recommend process optimizations.
• Diagnose and resolve complex equipment and process issues on large‑format panel substrates using structured root‑cause analysis.
• Address panel‑specific challenges like film uniformity, warpage, and edge‑to‑center metal profile control.

Required profile

• Master’s or Bachelor’s degree in Materials Science, Chemistry, Semiconductor Engineering or a related technical discipline.
• 3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
• Strong sense of ownership, attention to detail, and ability to work in physically demanding fab environments.
• Excellent communication skills and proficiency in English for technical documentation.
• Willingness to travel between Cheonan and Dongtan sites as required.

Required skills

• Hands‑on experience with PVD metallization (seed, barrier, metal‑stack deposition).
• Knowledge of advanced packaging technologies such as FOPLP, chiplet integration, and heterogeneous packaging.
• Understanding of process integration challenges in large‑format panel PVD processing.
• Experience with back‑end‑of‑line (BEOL) and panel‑level packaging process flows, including RDL metallization.