Advanced Packaging Process Support Engineer

About the role

As an Advanced Packaging Process Support Engineer at Applied Materials, you will guide semiconductor packaging products through their full lifecycle, from concept to qualification, providing on‑site customer support and driving innovative process development.

Key responsibilities

• Provide high‑visibility customer support through on‑site installations, system diagnoses, and service/repair of complex equipment.
• Collaborate with customers to develop leading‑edge processes for advanced semiconductor chips.
• Create hypothesis experiments and design of experiments (DOE), analyze data statistically, and compile high‑level reports.
• Troubleshoot complex problems, perform root‑cause analyses, and resolve difficult process engineering issues.
• Communicate with internal stakeholders and customers to build relationships and trust.
• Apply growing knowledge of company processes and customer needs to solve a range of technical challenges.

Required profile

• Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics or a related field.
• 2–4 years of experience in the semiconductor fab or equipment industry.
• Proficiency in English communication.

Required skills

• Chemical Vapor Deposition (CVD)
• Atomic Layer Deposition (ALD)
• Plasma Reactive Ion Etch (RIE)
• Physical Vapor Deposition (PVD)
• Anneal processes
• Implant techniques
• Design of Experiments (DOE)
• Statistical data analysis